|Future Factories: Research into new manufacturing technologies for cell and module production|
|06/ 2011 to 07/ 2014|
In order to successfully transfer efficiency increases at the solar cell level (e.g. selective emitters, back surface fields, etc.) to the module, changes must be made to the entire module design. The encapsulate and bonding technologies are investigated to minimize in particular the optical and electrical losses at the module level.
In addition to the module efficiency, higher reliability and increased yield in operation are the most important parameters for success. Fast test procedures and simulations are used to evaluate new module designs for their longevity and reliability characteristics. .
One issue that has already been identified in operation is the PID sensitivity of cells and modules, which can lead to significant production deficits. Research into the impact of cell and module designs (e.g. cell specifications and selection of encapsulate materials) on PID sensitivity will be conducted.
- Fraunhofer CSP
- ISC Konstanz